Piper Companies is seeking a Principal Packaging Engineer who will develop and refine Chip-on-Wafer-on-Substrate technology. The Packaging engineer will be preferred in office in Saratoga, CA, but is open to remote. Requirements for the Packaging Engineer include: - Innovate and enhance CoWoS packaging processes to boost chip performance, power efficiency, and reliability. - Collaborate with design, test, and manufacturing teams to ensure flawless chip-package integration. - Lead failure analys

Piper Companies is looking for a CoWoS Principle Packaging Engineer who will construct and enhance Chip-on-Wafer-on-Substrate packaging technology to support high-performance AI and data center applications onsite in Saratoga, CA . The ideal CoWoS Principle Packaging Engineer will collaborate with cross-functional teams to facilitate smooth integration of advanced multi-die packages. Responsibilities for the CoWoS Principle Packaging Engineer: Lead the advancement of CoWoS packaging technolog

Location: Fremont, CA Salary: $65.00 USD Hourly - $70.00 USD Hourly Description: Our client is currently seeking a Senior Engineer, Packaging Engineering This job will have the following responsibilities: o Support o Support EU MDR execution and implementation on SNV products. o Design and develop best in class packaging and labeling solutions from early concept through commercialization for sterile and non-sterile medical devices. o Drive continuous improvement and assessment of curren

Job Description: The client is seeking a highly creative and detail-oriented Packaging Design Engineer with experience in consumer electronics to develop iconic, functional, and sustainable packaging solutions that reflect care for our products, the people who use them, and the world we live in. Responsibilities: Create packaging solutions for consumer electronic products that balance protection, aesthetics, cost, and sustainability, while collaborating with suppliers to develop these solutions

Senior Hardware IC Packaging Design Engineer for Chip Design Company Summary: A premier chip and silicon IP provider making data faster and safer, is looking for a Packaging Design Engineer to join our Package Engineering team. This full-time role offers the opportunity to work on advanced packaging solutions with a world-class engineering team. You ll lead chip-package co-design and manage layout development from concept through tape-out, focusing on yield, reliability, and manufacturability. R

Job Description Join Our Team as an Electronics Packaging Engineer where you will work on the development of a sophisticated state-of-the-art avionics product in a world class Integrated Product Development environment. Location: Highlands Ranch CO About Us: Space is a critical domain, connecting our technologies, our security, and our humanity. While others view space as a destination, we see it as a realm of possibilities, where we can do more - we can innovate, invest, inspire, and integra

Descriptions & Requirements Job Description and Requirements We Are: At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation. You Are: You are a highly

Description The Mechanical Engineer - Packaging will work packaging design on project teams to create world class designs for new projects, alterations and redevelopments on a variety of projects including process, industrial, and manufacturing facilities. The Mechanical Engineer - Packaging will work in the project team throughout the design and construction process, adapting plans according to budget constraints, design factors or client needs. This role requires knowledge in types of packagin

Job Title: Principal Advanced Packaging Engineer Semiconductor & Chiplet Integration Location: Santa Clara, CA Visas: and H1b Industry: Semiconductor | Microelectronics | Advanced Packaging Experience Level: Senior (10+ Years) Position Summary We are seeking an experienced Principal Advanced Packaging Engineer with deep expertise in semiconductor packaging, chiplet integration, and high-speed interconnect design. This role will lead advanced packaging development efforts for next-generation AI

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. SR. IC LAYOUT ENGINEER (STARLINK) At SpaceX we're leveraging our experience in building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's largest s

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. SR. IC LAYOUT ENGINEER (SILICON ENGINEERING) At SpaceX we're leveraging our experience in building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world'

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. IC LAYOUT ENGINEER (SILICON ENGINEERING) At SpaceX we're leveraging our experience in building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's la