Overview
On Site
Full Time
Skills
Leadership
Design analysis
Design
Estimating
Fluid mechanics
Electronics
HPC
Specification
Layout
Bill of materials
Acoustics
Sensors
Thermal analysis
Testing
Data acquisition
Debugging
Optimization
Design documentation
Software deployment
Project management
Preventive maintenance
Performance management
Sales
Collaboration
Product development
Aerospace
Thermal management
Computer hardware
Heat transfer
Documentation
Communication
Mechanical engineering
Electrical engineering
Distribution
Access control
Management
Integrated circuit
Work ethic
Problem solving
Effective communication
Job Details
Job Description
Job Description
Job Summary:
We are seeking a passionate Thermal Application/Project Engineer to lead the cluster-level architecture, design, analysis, and validation of liquid cooling technologies for HPC customer needs. This role emphasizes a design process based on estimating, simulating, and testing the thermal performance of new products and architectures. The ideal candidate will possess a strong background in heat transfer, fluid dynamics, and implementing thermal solutions in enterprise electronics.
Responsibilities:
- Develop and validate thermal/liquid cooling solutions for HPC cluster platforms in accordance with industry standards and customer specifications.
- Evaluate system layout, power consumption, TCO, PID, BOM, acoustics, sensors, and related mechanical testing.
- Perform cluster-level thermal analysis, definition, and testing, including chamber test setup, thermocouple installation, and automated data acquisition.
- Conduct thermal debugging, system optimization, and documentation.
- Oversee the development, design, documentation, and deployment of cluster-level liquid cooling customer projects.
- Handle additional responsibilities such as rack integration, documentation, facilities preparation, on-site service, and support for PM/Sales/Field Application Engineers on customer projects.
- Collaborate with cross-functional product development teams and international partners to meet reliability, power efficiency, system performance, and cost requirements.
Qualifications:
- Bachelor s degree in Aerospace, Thermal, or Mechanical Engineering; a Master s degree is a plus.
- Experience with server/PC products focusing on mechanical or thermal functions is preferred.
- Proficient knowledge in thermal management hardware, heat transfer materials, heat exchangers, pumps, and cooling devices at a rack/cluster level.
- Strong skills in mechanical/thermal engineering analysis, validation, documentation, and communication.
- Familiarity with both mechanical/thermal and electrical/power aspects, including power distribution, AC power types, power calculations, DC power, and regulatory/safety considerations, is a plus.
- Experience with server/rack liquid cooling solutions, including DCL (direct chip liquid cooling), rear door liquid cooling, liquid immersion cooling, and chilled water piping, is advantageous.
- Must demonstrate a strong work ethic, the ability to thrive in a team environment, and adapt to a fast-paced setting.
- Excellent organizational and problem-solving skills.
- Effective communication skills, both verbal and written.
- Willingness to travel for on-site customer deployments.
Job Type: Full-time
Work Location: Anderson, SC
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