Overview
On Site
USD 66,002.00 per year
Full Time
Skills
IBM
Semiconductors
Research
Cloud computing
Artificial intelligence
Science
Hardware development
Art
Design
Integrated circuit
Computer hardware
Electrical engineering
Mechanical engineering
Computer science
Materials science
Physics
Chemistry
Semiconductor fabrication
Job Details
Introduction
IBM Research is seeking intern candidates who want to apply their classroom learning's to real world challenges. As a Hardware Engineer Intern in semiconductor research, you will work with world-class global researchers focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speeds required for next generation logic/memory technology and support applications such as hybrid cloud and artificial intelligence.
Your Role and Responsibilities
This is for a 2025 summer internship with the following start dates: May - August or June - September for quarter system schools.
In this role, you will investigate the feasibility of applying science and engineering principles towards innovative, new hardware design and applications from state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging. Background knowledge of engineering disciplines, computer science, physics, or materials science are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects.
Required Technical and Professional Expertise
Preferred Technical and Professional Expertise
IBM Research is seeking intern candidates who want to apply their classroom learning's to real world challenges. As a Hardware Engineer Intern in semiconductor research, you will work with world-class global researchers focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speeds required for next generation logic/memory technology and support applications such as hybrid cloud and artificial intelligence.
Your Role and Responsibilities
This is for a 2025 summer internship with the following start dates: May - August or June - September for quarter system schools.
In this role, you will investigate the feasibility of applying science and engineering principles towards innovative, new hardware design and applications from state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging. Background knowledge of engineering disciplines, computer science, physics, or materials science are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects.
Required Technical and Professional Expertise
- Candidate should be pursuing a Bachelor's Degree.
- Electrical engineering
- Mechanical Engineering
- Computer Science
- Materials Engineering
- Physics/Chemistry
Preferred Technical and Professional Expertise
- Semiconductor fabrication knowledge
- coursework
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.