Microelectronics ASIC Design Engineer

Radiance Technologies, a rapidly growing employee-owned company is searching for a talented Microelectronics Research and Development Engineer with ASIC design experience to join our Microelectronics Technology Operation. The candidate should have at least 5 years of ASIC design experience with both digital and analog design flow knowledge. Familiarity with EDA tools for digital place and route as well as analog full custom layout, simulation and parasitic extraction is desired. Full chip assembly knowledge is a plus with experience in pad design, ESD protection, and chip finishing operations for density, and layer fill. The candidate will perform a wide range of tasks in the execution of projects such as requirements definition, selection and acquisition of EDA tools as well as testing materials/equipment, design and performance of experiments, tests, and measurements, communication/coordination with stakeholders through various means including oral, written, and formal presentation, and other research and development tasks in the microelectronic security field.

Required Qualifications:

• Bachelor s degree in electrical engineering or relevant technical field
  
• Silicon foundry experience with process design kits and design flows
  
• Commercial EDA tool experience for ASIC chip assembly
  
• Working knowledge of front-end RTL synthesis and constraints
  
• Backend chip assembly knowledge including DRC/LVS verification
  
• Silicon packaging experience with wire bond and flip chip die attach
  
• PC Board layout and schematic working knowledge
  
• Advanced knowledge of microelectronics micro- and nano-fabrication processes and characterization techniques
  
• Ability to efficiently evaluate and solve problems
  
• Must be self-motivated and work well on a team
  
• Excellent written, oral and presentation skills using Microsoft Office software
  
• ship with the ability to obtain and maintain a security clearance
  

Desired Qualifications:

• Experience in microelectronics and materials characterization fields
  
• Experience in project management using tools such as Jira and Confluence
  
• Experience in mechanical design for 2.5D and 3D chip packaging
  
• Silicon thermal management and heat dissipation
  
• Active Security Clearance
  

EOE/Minorities/Females/Vet/Disabled